A method for preparing full-figure paper by metal plating includes coating a solution on a paper base then stitching a full figure microstructure providing layer on the paper base with pressure to form a temporary compound layer, among which, a full figure microstructure surface of the providing layer covers said solution on the paper base, then the covered solution in the compound layer is dried and cured and the microstructure providing layer is stripped out of the compound layer, the cured microstructure full figure coating is adhered on the paper base to form said full figure surface paper for the metal plating process with a full figure surface having the property corresponding to the full figure microstructure surface.