The present invention provides a semiconductive resin composition for use as a semiconductive layer in contact with a crosslinked wire and cable insulation layer is disclosed for use where the insulation layer is crosslinked using a peroxide cure system. The resin has a two component base polymer where the first component has a weight average molecular weight of not more than 200,000. The second component is either a polymer having a melting point between 110 DEG C. and 130 DEG C. or a nitrile rubber. The composition also has an adhesion modifying compound different from the base polymer andcarbon black. Methods of making the composition and cables using the composition are also disclosed.