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发明公开
CN1825580A 半导体器件 有权

半导体器件
摘要：
本发明提供在更高温度操作中接合线与电极焊盘之间的结合部分区域的改善的可靠性。半导体器件100包括提供在引线框121上的半导体芯片102，其是用密封树脂115密封的。在引线框121两侧提供引线框119。部分引线框119是用密封树脂115密封的以起到内引线117作用。密封树脂115由基本上不含卤素的树脂组合物组成。此外，将半导体芯片102中提供的Al焊盘107暴露部分通过AuPd导线111导电连接到内引线117。
摘要（英）：

An improved reliability of a junction region between a bonding wire and an electrode pad in an operation at higher temperature is presented. A semiconductor device 100 includes a semiconductor chip 102 provided on a lead frame 121, which are encapsulated with an encapsulating resin 115. Lead frames 119 are provided in both sides of the lead frame 121. A portion of the lead frame 119 is encapsulated with the encapsulating resin 115 to function as an inner lead 117. The encapsulating resin 115 is composed of a resin composition that contains substantially no halogen. Further, an exposed portion of the Al pad 107 provided in the semiconductor chip 102 is electrically connected to the inner lead 117 via the AuPd wire 111.

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