The present invention relates to a method of manufacturing a wiring board, a photomask, a wiring board, a circuit element and a communications device. A method for manufacturing a wiring board in which a space above a surface region including at least a portion of a wiring line can securely be sealed is disclosed. The method includes a first step of forming a metal thin film for wiring lines on aglass substrate 11a, a second step of forming a resist pattern on the metal thin film by using a photomask 20 where a pattern for the wiring lines is formed, and a third step of forming the wiring lines by selectively removing the metal thin film by wet etching using the resist pattern as a mask. When points of the wiring lines joined with frit glass 13 are regarded as joined places, sides (La, Lb, Lc, and Ld) of the pattern for the wiring lines of the photomask 20 are bent in areas corresponding to the joined places.