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发明授权
CN1874647B 印刷布线基板及半导体试验装置 失效 - 权利终止

印刷布线基板及半导体试验装置
摘要：
一种印刷布线基板，其构成为包括：第1布线层，其由通孔只分离第1距离而形成；第2布线层，其由所述通孔只分离比所述第1距离更小的第2距离而形成；接触层，其与插入到所述通孔中的连接管脚电连接；与所述接触层电连接的第3布线层；第4布线层，其由所述通孔只分离第3距离而形成；和第5布线层，其由所述通孔只分离比所述第3距离更大的第4距离而形成。由此，本发明可提供经由通孔而能够与被试验器件收发理想的波形的信号的印刷布线基板。
摘要（英）：

Disclosed is a printed-wiring board which comprises: a first wiring layer formed by a first distance separated with a through hole; a second wiring layer formed by a second distance smaller than the first distance separated with the through hole; a contacting layer electrically connected with the connection pin inserted in the through hole; a third wiring layer electrically connected with the contact layer; a fourth wiring layer formed by a third distance separated by the through hole; and a fifth wiring layer formed by a fourth distance bigger than the third distance separated by the throughhole.

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