Light emitting diodes are arranged with a package having an integral heat dissipation mechanism. A material having a high thermal conductivity is well coupled to a semiconductor chip providing a path for heat to be drawn away from the chip which is susceptible to overheat. In certain versions, heat dissipation mechanisms are also provided with a second terminal end which further facilitates removal of heat from the device package. The highly conductive path is formed integrally with other led package components and cooperates therewith to provide additional support for led functionality.