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发明授权
CN1919505B 制备SnZnNiCuAl焊料粉的方法及SnZnNiCuAl焊料粉 失效 - 权利终止

制备SnZnNiCuAl焊料粉的方法及SnZnNiCuAl焊料粉
摘要：
本发明提供一种通过液体淬火雾化法制备SnZnNiCu焊料粉的方法，其中雾化温度不低于500℃，特别是不低于900℃。用作焊料粉原料的原料金属包含相对于原料的总量为3至12重量％的Zn，总共为1.0至15重量％的Cu和Ni，以及余量的Sn和不可避免的杂质。因此，实现了高的连接强度，并且提供可以改善焊料接合部分的接合可靠性的SnZnNiCu焊料粉。
摘要（英）：

The present invention is a method to manufacture the SnZnNiCu solder powder through liquid quenching atomizing method, and an atomizing temperature is not less than 500 DEG C, in particular, not less than 900 DEG C. The raw material metal used as raw material of the solder powder comprises 3 to 12 % by weight of Zn, 1.0 to 15 % by weight of the sum of Cu and Ni, and Sn and inevitable impurities for the rest, to the total amount of raw material. Thereby, high joint strength is achieved and the SnZnNiCu solder powder which can improve joint reliability of solder joint part is provided.

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