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实用新型
CN201060274Y 一种遥测仪三总线信号匹配的厚膜电路 失效 - 权利终止

一种遥测仪三总线信号匹配的厚膜电路
摘要：
本实用新型涉及一种测井遥测仪三总线信号匹配的厚膜电路，将三总线信号的匹配电路封装到厚膜芯片里，厚膜芯片形状为长方形，包括有24个针状插脚，分为2排，每排12脚；内置三总线信号的匹配电路，电路包括：可编程控制器产生的GOHI和GOLO信号合成后产生DTB总线的3.6V电平的GO信号下行，同时1.2V上行的数据通过比较器比较后产生+5V的电平信号送入可编程控制器；DSIGNAL信号是下行命令，经过匹配电路输出±1.2V的归零脉冲信号送给井下仪器；UCLK信号是下行时钟，经过匹配电路输出+1.2V的脉冲信号送给井下仪器；厚膜电路提高了遥测仪的稳定性和抗干扰、减小电路的体积，便于仪器生产和检修。
摘要（英）：

The utility model relates to a three bus signal matching thick film circuit of a logging telemetry instrument. A three bus signal matching circuit is encapsulated in a thick film chip which is of a rectangle, the thick film chip comprises 24 needle-like prongs which are divided into two rows with 12 prongs in each row; the three bus signal matching circuit is arranged inside. The circuit comprises: 3.6V level GO signal downstream of the DTB buses is generated by the synthesis of GOHI and GOLO signals which are generated by a PLC; meanwhile, after being compared through a comparator, 1.2V upstream data generates 5V level signal which is sent to the PLC; the downstream order DSIGNAL signal outputs 1.2V return to a zero pulse signal through the matching circuit to a downhole tool; the downstream clock UCLK signal outputs +1.2V pulse signal through the matching circuit to the downhole tool. The film circuit has the advantages of improving the stability and anti-interference ability, reducing the volume of the circuit, and facilitating the manufacturing and test and maintenance of the instrument.

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