The utility model discloses a material polishing device, wherein an upper die stops in the horizontal direction and can be movably positioned above a lower die in the vertical direction; the upper ends of a plurality of material pressing pieces stop in the horizontal direction and can be elastically positioned at the lower end of the upper die in the vertical direction; the material pressing pieces are arranged at intervals in same direction; the lower ends of the material pressing pieces stop in the axial direction and are rotatably provided with material pressing pin rollers in the circumferential direction; the radial lowest end of the material pressing pin roller is lower than the lower end surface of the upper die and the lower end surfaces of the material pressing pieces; and the upper end of the lower die is fixedly provided with polishing pieces with the upper ends being shaped like closed angles and corresponding to the material pressing pin roller in number and position. The material polishing device scrapes the coating on the material surface needing polishing by the matching function of the material pressing pin rollers and the polishing pieces, thus replacing artificial grinding process, saving labor and time, having good grinding effect, effectively ensuring the smoothness and fineness of the materials, and reducing the grinding rejection rate.