The utility model discloses a vacuum sucking pen capable of sucking two wafers simultaneously. The vacuum sucking pen comprises a sucking pen head, a sucking pipe and a handle, wherein the sucking pipe and the handle are of an integral structure, the sucking pen head is of a blocky structure, the center of the sucking pen head is provided with a sucking pipe hole inosculated with the sucking pipe, the thickness of the sucking pen head is the same as a gap inside a quartz boat for storing silicon wafers, two side faces of the sucking pen head are respectively and symmetrically provided with a left sucking disk cavity and a right sucking disk cavity which are same in structure, the bottom of the sucking pipe hole is provided with a left air passage and a right air passage, both of which are communicated with the sucking pipe hole mutually, the left air passage is communicated with the left sucking disk cavity, and the right air passage is communicated with the right sucking disk cavity. According to the utility model, under the condition of not changing the main structure of the original vacuum sucking pen, double-wafer sucking can be realized just by replacing the sucking pen head, so that the reformation cost is lower, the wafer sucking efficiency is doubled, in addition, the end part of the sucking pen head is additionally provided with a longer wedge-shaped guide part which can be used to prevent the situation of silicon wafer crush caused by slantly inserting the vacuum sucking pen during rapid operation, and thus, the safety coefficient is higher.