A solid insulation casing grounding shielding structure comprises an insulating layer moulded by solidification, a high-potential conductor disposed in the insulating layer in a casing manner, and a grounding layer sprayed at an external surface of the insulating layer; and the insulating layer at the terminal of the grounding layer is provided with a groove, conductor or semiconductor materials are sprayed in the groove, and conductor or semiconductor materials are used for the grounding layer. The electric field concentration problem generated at a junction of three mediums of the grounding layer terminal sprayed outside the insulating layer in a solid insulation structure, the insulating layer and air can be optimized; by disposing the groove structure in the insulating layer at the terminal position of the grounding layer, the field strength of the air at the position can be uniformly distributed without exceeding the breakdown field strength of the air; internal shielding rings are taken away, relatively high tolerance field strength of solid insulating materials is fully utilized, so that the whole insulation structure is simpler; and product production cost is relatively low, and reliability is relatively high, thereby facilitating taking advantage of the solid insulation technology.