The utility model discloses a heat dissipation structure for IGBT modules. The structure comprises two heat dissipators arranged in the left and right horizontally. The axes of the two heat dissipators are overlapped. Each of the heat dissipators comprises a substrate, heat dissipating fins, and heat dissipating modules, wherein the heat dissipating fins are arranged on the outer side of the substrate and fixedly connected with the substrate; the inner side face of the substrate is provided with the two heat dissipation modules along the transverse direction of the substrate; each heat dissipation module comprises multiple heat pipes arranged along the longitudinal direction of the substrate; the inner side of the substrate is provided with grooves in shapes matched with those of the heat pipes; the heat pipes are arranged in the grooves and fixedly connected with the substrate; and the outer side faces of the heat pipes and the inner side face of the substrate are in a same plane. As external fresh air can be led into the heat dissipator in the downstream directly through the gap between the two heat dissipators, the pressure reduction of the two ends of the whole heat dissipator in the downstream can be decreased effectively; the overall system blast capacity can be increased; and thus the temperature of heat sources can be lowered.