The utility model discloses a thermal protection type piezoresistor. The thermal protection type piezoresistor comprises a zinc oxide piezoresistor ceramic chip, silver electrode layers, an insulating sheet, a first pin, a second pin, a thermal-fusing fuse and an epoxy resin outer wrapping layer. The upper surface and the lower surface of the zinc oxide piezoresistor ceramic chip are respectively provided with a silver electrode layer. The first pin is welded on the silver electrode layer on the lower surface of the zinc oxide piezoresistor ceramic chip. The epoxy resin outer wrapping layer wraps a body. The second pin is fixed on one side of the silver electrode layer on the upper surface through the insulating sheet. One end of the thermal-fusing fuse is welded with the inner end of the second pin while the other end is correspondingly welded with the other end of the silver electrode layer. The thermal-fusing fuse part on the welding end of the second pin is provided with a bending part bending outwards. An offset gap is formed between the thermal-fusing fuse and the silver electrode layer on the upper surface through the bending part. The thermal protection type piezoresistor ensures a required gap between the fuse and the silver electrode layer plane. Furthermore, the thermal protection type piezoresistor guarantees that no solder balls or false welding will be generated when the fuse and the pin are welded.