The utility model relates to an adhesion device for chips-on-films and belongs to the field of display technologies. The adhesion device comprises a base an rotary table, a first driving device, a TCP side adhesive attaching mechanism, a PCB side adhesive attaching mechanism and a pre-pressing mechanism, wherein the first driving device rotates around the axial line of a driving rotary table, the TCP side adhesive attaching mechanism is used for attaching conduction adhesive to a chip-on-film located on a loading platform in a TCP adhesive attachment area, the PCB side adhesive attaching mechanism is used for attaching the conduction adhesive to the a chip-on-film located on a loading platform in a PCB adhesive attachment area, and the pre-pressing mechanism is used for pre-pressing the conduction adhesive attached to a chip-on-film on a loading platform in a pre-pressing area. The rotary table is sequentially located on a first working station, a second working station, a third working station, and a fourth working station when rotating, and the loading platforms exist in an assembling and disassembling area, the TCP adhesive attachment area, the PCB adhesive attachment area and the pre-pressing area respectively when the rotary table is located on any one of the working stations, wherein the assembling and disassembling area, the TCP adhesive attachment area, the PCB adhesive attachment area and the pre-pressing area are arranged on the base. When chip-on-film adhesion is carried out through the adhesion device for chips-on-films, the parallel operation that the chips-on-films adhesion is synchronously and continuously carried out on the multiple chips-on-films is adopted, and therefore the adhesion efficiency of the chips-on-films can be improved.