The utility model discloses a heat dissipation sticky tape to the metal forming is the substrate, and it has the heat -conducting glue to coat below this substrate the heat radiation coating that the higher authority of substrate had coated and has compriseed nanometer silica and silicon resin. The passive radiating mode that relies on the air convection with ordinary heat dissipation sticky tape is different, the utility model discloses a heat dissipation sticky tape adopts infrared's initiative radiating mode, and the radiating effect is better, especially has better heat dissipation cooling performance in the constrictive inner space of digital product such as smart mobile phone, panel computer.