The embodiment of the utility model provides a chip module packaging structure relates to the electric power tech field, can the simplifying processing process, can shorten the encapsulation time, reduction in production cost. Chip module packaging structure includes: a plurality of chips, the setting element, be provided with array distribution's hole unit, every on the setting element the hole unit is used for fixed one the chip, a housing, the casing is including top shell, well ring sum drain pan, the edge of top shell and drain pan respectively with the last under shed joint of zhonghuan, it is provided with a plurality of first molybdenum sheets to fix on the shell of top, first molybdenum sheet corresponds with the position of hole unit, the one side of first molybdenum sheet with the first ploe contact of chip, a plurality of bosss, the boss set up in on the drain pan of casing, fixed being provided with on the boss the second molybdenum sheet, the one side of second molybdenum sheet with the second ploe contact of chip.