An embodiment of the utility model provides a package structure of semiconductor device relates to microelectronics technical field, can reduce semiconductor device's encapsulation complexity, reduces semiconductor device's thermal resistance simultaneously and switches on the pressure drop. Package structure of semiconductor device includes tube cap and tube socket, and the tube cap lid is on the tube socket, and the lower skin weld of tube cap has a plurality of first electrode molybdenum sheets, and the last skin weld of tube socket has a plurality of second electrode molybdenum sheets, a plurality of second electrode molybdenum sheets and a plurality of first electrode molybdenum sheet one -to -ones, still include a plurality of chips and a plurality of location frame, the location frame is used for advancing line location to the chip, a plurality of chips and a plurality of first electrode molybdenum sheet one -to -ones, the chip is located between first electrode molybdenum sheet and the second electrode molybdenum sheet, and chip and first electrode molybdenum sheet and second electrode molybdenum sheet are all laminated. The utility model is used for the semiconductor device encapsulation.