The utility model discloses a high heat dissipation efficiency's LED packaging body, the semiconductor chip packaging structure comprises a heat radiation substrate, last the opening of radiating basal plate has a plurality of conical groove, and conical groove has bottom surface and conical side, all conical groove distribute on the circumference array that many circles set up with one heart, andconical groove distributes comparatively sparsely on the circumference array including and, and conical groove distributes comparatively closely on outer circumference array, all be provided with theLED chip in every conical groove, not grooved one side of radiating basal plate is provided with the heat dissipation muscle. The utility model discloses a plurality of LED chips on high heat dissipation efficiency's LED packaging body's the radiating basal plate adopt the interior outer close encapsulation mode that dredges for temperature on the base plate is comparatively even, and its maximumtemperature is low during also than the equipartition, and high heat dissipation efficiency can further be carried to radiating basal plate's heat dissipation muscle.