The utility model provides a be applied to packaging composite film for electronic components, this complex film includes: electric charge dissipation layer, thermoplastic resin peel ply, intermediatelevel, adhesive linkage and the substrate layer of setting stack gradually on the follow extremely down, the thermoplastic resin peel ply includes resin layer an and resin layer b. This complex filmnot only can form good adaptation with multiple plastics carrier band or carrier band cladding, and the electronic components of parcel can and take out by the accurate positioning, simultaneously, has good ageing resistance ability, can show to improve and carry / cover the life in area.