Invention Grant
EP0016835B1 HOT MELT ADHESIVE FOR ELASTIC BANDING AND METHODS FOR UTILIZING THE SAME
失效
用于弹性带的热熔粘合剂及其使用方法
- Patent Title: HOT MELT ADHESIVE FOR ELASTIC BANDING AND METHODS FOR UTILIZING THE SAME
- Patent Title (中): 用于弹性带的热熔粘合剂及其使用方法
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Application No.: EP79901280.2Application Date: 1979-09-21
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Publication No.: EP0016835B1Publication Date: 1984-06-13
- Inventor: BUNNELLE, William L. , LINDMARK, Richard C.
- Applicant: H.B. FULLER COMPANY
- Applicant Address: 2400 Kasota Avenue St.Paul, MN 55108 US
- Assignee: H.B. FULLER COMPANY
- Current Assignee: H.B. FULLER COMPANY
- Current Assignee Address: 2400 Kasota Avenue St.Paul, MN 55108 US
- Agency: Redies, Bernd
- Priority: US944845 19780922; US966794 19781206; US36858 19790507
- International Announcement: WO8000676 19800417
- Main IPC: B31F1/12
- IPC: B31F1/12 ; B32B31/08 ; B32B31/20 ; C08K5/01 ; A41B9/14
Abstract:
A purpose of the disclosed method is to impart gathers and elasticity to a relatively inelastic film, membrane, or web substrate, through elastic banding with a viscoelastic hot melt pressure-sensitive adhesive (PSA). Typically, the resulting elastic-banded substrate product (e.g. 40) will be cut into discrete units and formed into garments or body-encircling members such as disposable diapers. One step of the preferred method involves extruding a ribbon or band (13 or 113) comprising a viscoelastic hot melt PSA, which PSA has unusually high cohesion, stretchiness, and elasticity without excessive loss of adhesive bonding strength. (The viscoelastic behavior of the PSA is believed to be determined, at least in part, by the relative size of its crystalline domains and its rubbery domains and the glass transition temperatures and softening points of its components.) A second step of the preferred method involves bringing the band of hot melt (13 or 113) into adherent contact with a surface of a moving continuous substrate (22 or 32 or 132). A typical substrate would be the polyolefin film used in the manufacture of disposable diapers. The band can be bonded to the substrate through a pressure activation technique, wherein the band itself has the necessary inherent adhesive properties.
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