发明公开
- 专利标题: ENDODONTIC FILLING SYSTEM
- 专利标题(中): 牙体充填系统
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申请号: EP82302220申请日: 1982-04-29
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公开(公告)号: EP0064845A3公开(公告)日: 1983-12-07
- 发明人: TATEOSIAN, LOUIS H. , ROYER, JAMES R. , EDEN, GEORGE T.
- 申请人: DENTSPLY INTERNATIONAL INC.
- 专利权人: DENTSPLY INTERNATIONAL INC.
- 当前专利权人: DENTSPLY INTERNATIONAL INC.
- 优先权: US26178581 1981-05-08
- 主分类号: A61K6/09
- IPC分类号: A61K6/09 ; A61C5/04 ; A61K6/00 ; A61K6/033 ; A61K6/08
摘要:
Endodontic filling systems are provided having im proved properties over those known to the prior art. Endodontic points are provided comprising hydrophilic, polymeric compositions (40). Such points are swellable when placed into a prepared root canal space (36) and provide substantially complete filling of lateral cavity spaces (38) without invasion of the subapicial space. According to a preferred embodiment, such points are used in conjunction with pastes or fluids comprising hydrophilic, polymeric compositions.
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