发明公开
EP0105003A1 Method of screening resin-sealed semiconductor devices
失效
一种用于检查kunstharzgekapselten半导体器件的方法。
- 专利标题： Method of screening resin-sealed semiconductor devices
- 专利标题（中）： 一种用于检查kunstharzgekapselten半导体器件的方法。
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申请号： EP83401874.9申请日： 1983-09-26
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公开(公告)号： EP0105003A1公开(公告)日： 1984-04-04
- 发明人: Nakamura, Kazuo
- 申请人： FUJITSU LIMITED
- 申请人地址： 1015, Kamikodanaka, Nakahara-ku Kawasaki-shi, Kanagawa 211 JP
- 专利权人： FUJITSU LIMITED
- 当前专利权人： FUJITSU LIMITED
- 当前专利权人地址： 1015, Kamikodanaka, Nakahara-ku Kawasaki-shi, Kanagawa 211 JP
- 代理机构： Joly, Jean-Jacques
- 优先权： JP168933/82 19820928
- 主分类号： H01L21/66
- IPC分类号： H01L21/66 ; G01R31/28
摘要：
A method of screening resin-sealed semiconductor devices having a resin body (16) for sealing and a semiconductor chip (11) mounted on a die stage (15) having a first and a second bar (10), said first and second bars extending from said die stage (15) to opposite side surfaces of the body and having a first and a second end (12,13) exposed to said side surfaces, which method comprises the steps of applying electric voltage (14) between said first and second ends to heat the semiconductor chip (11), and subjecting the device to screening test.
公开/授权文献
- EP0105003B1 Method of screening resin-sealed semiconductor devices 公开/授权日：1987-03-11
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