发明公开
- 专利标题： Desoldering apparatus and method
- 专利标题（中）： Verfahren und Vorrichtung zumEntlöten。
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申请号： EP83110961.6申请日： 1983-11-03
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公开(公告)号： EP0112468A1公开(公告)日： 1984-07-04
- 发明人: Slack, John Robert , von Voss, William Ditlef
- 申请人： International Business Machines Corporation
- 申请人地址： Old Orchard Road Armonk, N.Y. 10504 US
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： Old Orchard Road Armonk, N.Y. 10504 US
- 代理机构： Neuland, Johannes (DE)
- 优先权： US450170 19821217
- 主分类号： B23K1/00
- IPC分类号： B23K1/00 ; B23K3/00
摘要：
The selective removal of the solder (19) and/or a connector (17) soldered in the through hole (12) of a circuit panel (10) is accomplished by heating the solder and a pair of aligned hollow tubes (30, 31) placed against opposite surfaces of the panel surrounding the connecting through hole with the tubes being supplied with fluid under pressure to produce a pressure differential across the solder column in the through hole. This urges the connector and/or the solder from the through hole into the low pressure tube when the solder is melted.
公开/授权文献
- EP0112468B1 Desoldering apparatus and method 公开/授权日：1986-10-15
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