半导体功率模块包括至少两个相互平行的陶瓷衬底，每个陶瓷衬底具有两个侧面，金属化层设置在每个衬底的至少一侧上，至少一个被控制的半导体功率部件设置在每个两个相应的衬底之间并且被上述的金属化部分接触， 在部件下方，部件上方的基板具有形成在部件上方的至少一个孔，用于容纳到部件的控制连接。

In order to avoid consuming soldering forms for the production of modules with controlled power semiconductor devices, a power semiconductor module (1) with at least two parallel substrates (2, 3) is proposed, wherein between two respective substrates (2, 3) at least one controlled power semiconductor component (5) is arranged, the direct or via shims (7) is contacted with a metallization (4) on the substrates (2, 3) above and below the controlled power semiconductor component (5). All line connections can be present in the form of conductor tracks (9) on ceramic plates (2, 3) or sleeves (17) or contact stamp (10) between substrates (2, 3) can be realized, so that contact brackets omitted.