发明公开
- 专利标题： Copper-type conductive coating composition
- 专利标题（中）： 铜型导电涂料组合物
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申请号： EP85108001申请日： 1985-06-27
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公开(公告)号： EP0170063A3公开(公告)日： 1986-08-13
- 发明人: Yamaguchi, Shoji Mitsubishi Petrochem. Co., Ltd. , Yamada, Kimiko Mitsubishi Petrochem. Co., Ltd.
- 申请人： MITSUBISHI PETROCHEMICAL CO., LTD.
- 专利权人： MITSUBISHI PETROCHEMICAL CO., LTD.
- 当前专利权人： MITSUBISHI PETROCHEMICAL CO., LTD.
- 优先权： JP16089384 19840731; JP19973884 19840925
- 主分类号： H01B01/22
- IPC分类号： H01B01/22
摘要：
A copper-type conductive coating composition which comprises:
(A) a copper powder with hydrogen loss of at most 0.2% by weight or a copper powder with its oxidized surface layer removed by treatment with an organic carboxylic acid, (B) a coating binder resin, and (C) an antioxidant selected from triazoles represented by the formula:
wherein Y is a hydroxyl group, a hydrogen atom, a C 1 -C 18 alkyl group or a halogen atom, and a is an integer of 1 to 3, and trithiophosphites represented by the formula:
wherein each of R, to R 3 is a C 1 -C 30 alkyl group or an allyl group.
(A) a copper powder with hydrogen loss of at most 0.2% by weight or a copper powder with its oxidized surface layer removed by treatment with an organic carboxylic acid, (B) a coating binder resin, and (C) an antioxidant selected from triazoles represented by the formula:
wherein Y is a hydroxyl group, a hydrogen atom, a C 1 -C 18 alkyl group or a halogen atom, and a is an integer of 1 to 3, and trithiophosphites represented by the formula:
wherein each of R, to R 3 is a C 1 -C 30 alkyl group or an allyl group.
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