发明公开
EP0186831A2 Method of improving the adhesion between a photosensitive adhesive and a dielectric substrate
失效
一种用于改善感光性粘接剂和一个电介质基片之间的粘接效果的方法。
- 专利标题： Method of improving the adhesion between a photosensitive adhesive and a dielectric substrate
- 专利标题（中）： 一种用于改善感光性粘接剂和一个电介质基片之间的粘接效果的方法。
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申请号： EP85115909.5申请日： 1985-12-13
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公开(公告)号： EP0186831A2公开(公告)日： 1986-07-09
- 发明人: Gelorme, Jeffrey Donald , Lawrence, William Howell , Slota, Peter, Jr.
- 申请人： International Business Machines Corporation
- 申请人地址： Old Orchard Road Armonk, N.Y. 10504 US
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： Old Orchard Road Armonk, N.Y. 10504 US
- 代理机构： Kreidler, Eva-Maria, Dr. rer. nat.
- 优先权： US688388 19850102
- 主分类号： H05K3/38
- IPC分类号： H05K3/38 ; H05K3/10 ; C23C18/22
摘要：
The surface of a substrate is roughened by providing a substrate which comprises a resinous material and an inorganic particulate material; and etching a surface of the substrate to selectively etch the resinous material and thereby produce the roughened surface. The preferred etching process is a dry etching process.
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