发明公开
- 专利标题： Tin, lead, or tin-lead alloy plating bath
- 专利标题（中）： 电镀锡，铅或锡 - 铅合金。
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申请号： EP86102271.3申请日： 1986-02-21
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公开(公告)号： EP0192273A1公开(公告)日： 1986-08-27
- 发明人: Obata, Keigo , Dohi, Nobuyasu , Okuhama, Yoshiaki , Masaki, Seishi , Okada, Yukiyoshi , Yoshimoto, Masakazu
- 申请人： Obata, Keigo , Dohi, Nobuyasu , Daiwa Fine Chemicals Co., Ltd. , Ishihara Chemical Co., Ltd.
- 申请人地址： 8-1, Koriki-cho Himeji-shi Hyogo-ken JP
- 专利权人： Obata, Keigo,Dohi, Nobuyasu,Daiwa Fine Chemicals Co., Ltd.,Ishihara Chemical Co., Ltd.
- 当前专利权人： Obata, Keigo,Dohi, Nobuyasu,Daiwa Fine Chemicals Co., Ltd.,Ishihara Chemical Co., Ltd.
- 当前专利权人地址： 8-1, Koriki-cho Himeji-shi Hyogo-ken JP
- 代理机构： Schwan, Gerhard, Dipl.-Ing.
- 优先权： JP32746/85 19850222
- 主分类号： C25D3/32
- IPC分类号： C25D3/32 ; C25D3/36 ; C25D3/60
摘要：
A tin, lead, or tin-lead alloy plating bath comprising, as essential ingredients, an alkali metal salt, and a soluble divalent tin compound or/and a lead compound, all of an aliphatic or aromatic sulfocarboxylic acid of the general formula
wherein R is a C 1-4 hydrocarbon radical, M 1 is a hydrogen atom or alkali metal atom, M 2 is an alkali metal atom, and X 1 and X 2 are each a hydrogen atom, OH, COON, or SO 3 N (where N represents a hydrogen atom or alkali metal atom).
wherein R is a C 1-4 hydrocarbon radical, M 1 is a hydrogen atom or alkali metal atom, M 2 is an alkali metal atom, and X 1 and X 2 are each a hydrogen atom, OH, COON, or SO 3 N (where N represents a hydrogen atom or alkali metal atom).
公开/授权文献
- EP0192273B1 Tin, lead, or tin-lead alloy plating bath 公开/授权日：1989-04-26
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