The present invention is a conductive adhesive composition containing pressure sensitive adhesive solids and a plurality of silver-coated spheres. The spheres are distributed throughout the composition in a packing configuration which yields a conductive network of adjacent silver surfaces. The composition demonstrates both good cohesive strength-comparable to that of the constituent pressure sensitive adhesive solids taken alone-and good conductivity. Good cohesive strength and conductivity are accomplished by controlling the amount, the average diameter and the particle size distribution of the silver-coated glass spheres in relation to the amount of adhesive solids present in the composition. The composition has utility in a wide variety of industrial and medical applications and is particularly well suited for use in diagnostic procedures such as electro-encephalography and cardiography. A laminated electrode facing incorporating the conductive adhesive is also disclosed.