发明公开
- 专利标题： Plating bath and method for electroplating tin and/or lead
- 专利标题（中）： 电镀浴和方法，用于锡和/或铅的电镀。
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申请号： EP86304948.2申请日： 1986-06-25
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公开(公告)号： EP0207732A1公开(公告)日： 1987-01-07
- 发明人: Opaskar, Vincent C. , Bokisa, George S.
- 申请人： MCGEAN-ROHCO, INC.
- 申请人地址： 1250 Terminal Tower Cleveland Ohio 44113 US
- 专利权人： MCGEAN-ROHCO, INC.
- 当前专利权人： MCGEAN-ROHCO, INC.
- 当前专利权人地址： 1250 Terminal Tower Cleveland Ohio 44113 US
- 代理机构： Lamb, John Baxter
- 优先权： US749176 19850626; US826849 19860206
- 主分类号： C25D3/32
- IPC分类号： C25D3/32 ; C25D3/36 ; C25D3/60
摘要：
An aqueous tin, lead or tin-lead alloy electroplating bath comprises
(A) a bath-soluble stannous salt and/or a bath-soluble lead salt;
(B) an alkane sulphonic acid and/or an alkanol sulphonic acid;
(C) a surfactant;
(D) a primary binding agent which is a halo-substituted benzaldehyde or a diaikoxy- or tri-substituted benzaldehyde containing from 1 to 4 carbon atoms in the alkoxy groups; and
(E) a secondary brightening agent which is a lower aliphatic aldehyde.
(A) a bath-soluble stannous salt and/or a bath-soluble lead salt;
(B) an alkane sulphonic acid and/or an alkanol sulphonic acid;
(C) a surfactant;
(D) a primary binding agent which is a halo-substituted benzaldehyde or a diaikoxy- or tri-substituted benzaldehyde containing from 1 to 4 carbon atoms in the alkoxy groups; and
(E) a secondary brightening agent which is a lower aliphatic aldehyde.
公开/授权文献
- EP0207732B1 Plating bath and method for electroplating tin and/or lead 公开/授权日：1992-02-12
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