发明公开
- 专利标题: Cast molding of acrylic plastics
- 专利标题(中): Giessen von Acrylharzen。
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申请号: EP86305493.8申请日: 1986-07-16
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公开(公告)号: EP0209382A2公开(公告)日: 1987-01-21
- 发明人: Inoue, Takao , Sakairi, Tadashi , Aritomi, Mitsutoshi Mitsubishi Petrochem. Co. Ltd. , Takeyama, Tadao Mitsubishi Petrochem. Co. Ltd. , Matuo, Takahiro
- 申请人: MITSUBISHI PETROCHEMICAL CO., LTD. , MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- 申请人地址: 5-2, 2-chome, Marunouchi Chiyoda-ku Tokyo 100 JP
- 专利权人: MITSUBISHI PETROCHEMICAL CO., LTD.,MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- 当前专利权人: MITSUBISHI PETROCHEMICAL CO., LTD.,MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- 当前专利权人地址: 5-2, 2-chome, Marunouchi Chiyoda-ku Tokyo 100 JP
- 代理机构: Diamond, Bryan Clive (GB)
- 优先权: JP156494/85 19850716; JP123968/86 19860529
- 主分类号: B29C39/00
- IPC分类号: B29C39/00 ; B29C35/02
摘要:
A mixture of polyfunctional (meth)acrylate compound containing a C2-50 alcohol residue (100 parts),0.01-10 parts by wt of a radical initiatior and optionally up to 10 wt % of another radical polymerisable monomer as viscosity controller (e.g. styrene) is poured into a mold (formed by a ring on a glass plate), and polymerised at 10-200°C for not more than 2 hours under heating, light or electron beam irradiation, until the glass transition temperature (Tg) is 10 to 100°C, and the transparent plastics disc formed is removed from the mold without breakage.
The substrate is then post-cured on a flat surface by heating or UV or electron beam irradiation until its Tg is 150°C, and preferably further post-cured until its Tg is 200°C, to remove residual strain and double bonds.
A recording layer for an optical or magneto-optical disc is formed on the substrate; a higher post-curing temperature reduces the number of pinholes in the layer.
The substrate is then post-cured on a flat surface by heating or UV or electron beam irradiation until its Tg is 150°C, and preferably further post-cured until its Tg is 200°C, to remove residual strain and double bonds.
A recording layer for an optical or magneto-optical disc is formed on the substrate; a higher post-curing temperature reduces the number of pinholes in the layer.
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