An apparatus 10 for removing a mask 11 which extends beyond the outer edges of a semiconductor wafer 12 bonded thereto. The apparatus includes a base 22 having a vacuum chamber 26 opening onto the upper surface of the base, a vacuum valve 20 separating the vacuum chamber 26 from a vacuum source 21, an actuating lever 16 and a mask discharge facilitator 27. The discharge facilitator 27 comprises a horizontal plate 19 having a plurality of vertical pins 18 around the periphery thereof. When the lever 16 is actuated, it opens the vacuum valve and lifts the discharge facilitator forcing the vertical pins 18 into contact with the mask 11. The simultaneous application of the vacuum holding force, and vertical force applied by the pins causes the separation of the mask from the upper surface of the wafer.