发明公开
EP0218191A2 Formation of laminated structures by selective dielectric heating of bonding film 失效
通过粘合剂膜的介电加热多层结构的制造。

Formation of laminated structures by selective dielectric heating of bonding film
摘要:
Multiple materials are bonded together by means of an RF-sensitized bonding film or sheet, wherein the RF-sensitized bonding film or sheet is inserted at an intermediate position adjacent to the multiple materials to be bonded, and exposed to a dielectric field for such period of time so as to effect fusion or sintering of the RF-sensitized bonding film or sheet to the multiple materials so as to bond the multiple materials together and form a laminated structure.
信息查询
0/0