A semiconductor strain gauge bridge circuit device is disclosed to include a bridge circuit (2) of semiconductor strain gauges, a first zero-point temperature compensation circuit (3) connected to one (b) of a pair of output terminals of the bridge circuit and including a voltage-dividing resistor circuit (R 21 , R z2 ) generating a voltage substantially equal to a potential appearing at the one output terminal at a predetermined temperature, and a second zero-point temperature compensation circuit (4) connected to the other (d) of the output terminals and including a resistive element (R ZTH ) having a temperature characteristic similar to that of the semiconductor strain gauges.