A multilayered thin film metallurgy for brazing input/­output pins to a ceramic substrate is disclosed. A thin adhesion layer (22), which can suitably be a refractory metal such as titanium, vanadium, chromium or tantalum, is first formed on the surface of the substrate (10). A thick stress reducing layer (24) of soft metal such as copper, silver, nickel, aluminum, gold or iron is subsequently formed over the adhesion layer. To prevent the soft metal from reacting with subsequently brazed gold-tin pin eutectic alloy, a reaction barrier layer (28) which can be titanium or zirconium is then deposited over the soft stress reducing metal cushion layer. The process is com­pleted by finally depositing a gold layer (30) over the reaction barrier layer.