发明公开
- 专利标题: Process for bonding laminates
- 专利标题(中): Verfahren zum Verkleben von Substraten。
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申请号: EP87107157.7申请日: 1987-05-18
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公开(公告)号: EP0248254A2公开(公告)日: 1987-12-09
- 发明人: Rains, Randall C. , Dormish, Jeffrey F. , Stanton, Susan A. , Rieck, James N. , Stepanski, Horst, Dr.
- 申请人: MOBAY CORPORATION , BAYER AG
- 申请人地址: Patent Department Mobay Road Pittsburgh Pennsylvania 15205-9741 US
- 专利权人: MOBAY CORPORATION,BAYER AG
- 当前专利权人: MOBAY CORPORATION,BAYER AG
- 当前专利权人地址: Patent Department Mobay Road Pittsburgh Pennsylvania 15205-9741 US
- 代理机构: Gremm, Joachim, Dr.
- 优先权: US868866 19860530; US925002 19861029
- 主分类号: C09J175/04
- IPC分类号: C09J175/04 ; B32B7/12
摘要:
The present invention is related to a structural member comprising a laminate and an adhesive where said adhesive is the reaction product of a) 100 parts by weight of at least one hydroxy functional material having a molecular weight of at least 300 and a hydroxy functionality of at least 2 which material is preferably selected from the group consisting of polyether polyols, polyester polyols, polyester amide polyols, and polycarbonate polyols, b) 2 to 20 parts by weight of an aliphatic, aromatic and/or cycloaliphatic diamine or triamine, and c) an organic isocyanate in an amount sufficient to render the isocyanate index between about 70 and about 150, wherein said component c) is not pre-reacted with any of the component a) and b). In a preferred embodiment, there is included upto 50 parts by weight of component d) which is an aliphatic polyol having a functionality of at least 2 and a molecular weight of below 300. The invention also relates to a process for bonding substrates especially laminates which comprises applying a reaction mixture forming said adhesive preferably with aid of a counter current mixing device forming non-sagging beads of said reaction mixture.
公开/授权文献
- EP0248254B1 Process for bonding laminates 公开/授权日:1992-04-22
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