发明公开
- 专利标题： A coupling plate having a plurality of electric coupling points, a method of producing such a plate and a use of the coupling plate as a planning board
- 专利标题（中）： 电路板用的电路点多重性，其制造方法和使用该电路基板的作为规划板。
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申请号： EP87113238.7申请日： 1987-09-10
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公开(公告)号： EP0259874A2公开(公告)日： 1988-03-16
- 发明人: Kortegaard, Per
- 申请人： A/S MODULEX
- 申请人地址： Klovervej 101 DK-7190 Billund DK
- 专利权人： A/S MODULEX
- 当前专利权人： A/S MODULEX
- 当前专利权人地址： Klovervej 101 DK-7190 Billund DK
- 代理机构： Glaeser, Joachim, Dipl.-Ing.
- 优先权： DK4369/86 19860912
- 主分类号： G09F7/06
- IPC分类号： G09F7/06 ; H01R23/68 ; H05K3/40
摘要：
A coupling plate with a plurality of electric coupling points comprises, in a preferred embodiment, a pair of plane plates (10, 12), between which there is provided an electrically insulating carrier layer (11), on which a pattern of electrically conducting areas (21-26) is provided. In the preferred embodiment, an electric coupling point is provided for each mechanical coupling stud (15) projecting from the upper side of the top plate (10). The studs (15) are hollow and flush with projections (19) on the lower plate (12) so that punched parts of the electrically conducting areas (20, 22, 24, 26) are just moved up into the hollow coupling studs by means of the projections (19) on the lower plate (12), thus making the conducting areas accessible through cuts (16) in the coupling studs (15). The invention also concerns a method of producing such a plate and a board consisting of a plurality of interconnected plates of said type.
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