A thin film of SiO₂ (32) is patterned on an N layer consist­ing of N-type Aℓ x Ga 1-x N (inclusive of x = 0) (31). Next, I-type Aℓ x Ga 1-x N (inclusive of x = 0) (33) is selectively grown and the portion on the N layer (31) grows into an I-layer (33) consisting an active layer of a light emitting diode, and that on the SiO₂ thin film (32) grows into a conductive layer (34). Electrodes (35,36) are formed on the I-layer (33) and conductive layer (34) to constitute the light emitting diode. Also, on the surface a ({11 2 0}) of a sapphire substrate (24), a buffer layer (30) consisting of aluminum nitride is formed, onto which a gallium nitride group semiconductor (31) is formed.