发明授权
- 专利标题: Plasma apparatus
- 专利标题(中): Plasmavorrichtung
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申请号: EP88101007.8申请日: 1988-01-23
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公开(公告)号: EP0280044B1公开(公告)日: 1997-05-07
- 发明人: Nishimae, Junichi c/o MITSUBISHI DENKI K.K. , Yoshizawa, Kenji c/o MITSUBISHI DENKI K.K. , Taki, Masakazu c/o MITSUBISHI DENKI K.K. , Ueda, Yoshihioro c/o MITSUBISHI DENKI K.K. , Yanagi, Tadashi c/o MITSUBISHI DENKI K.K. , Iwata, Akihiko c/o MITSUBISHI DENKI K.K.
- 申请人: MITSUBISHI DENKI KABUSHIKI KAISHA
- 申请人地址: 2-3, Marunouchi 2-chome Chiyoda-ku Tokyo 100 JP
- 专利权人: MITSUBISHI DENKI KABUSHIKI KAISHA
- 当前专利权人: MITSUBISHI DENKI KABUSHIKI KAISHA
- 当前专利权人地址: 2-3, Marunouchi 2-chome Chiyoda-ku Tokyo 100 JP
- 代理机构: Eisenführ, Speiser & Partner
- 优先权: JP15690/87 19870126; JP18071/87 19870128; JP195185/87 19870806; JP225202/87 19870910; JP225205/87 19870910; JP225206/87 19870910; JP225208/87 19870910; JP225209/87 19870910; JP225211/87 19870910; JP225214/87 19870910; JP225215/87 19870910; JP225219/87 19870910; JP225220/87 19870910; JP225221/87 19870910; JP225222/87 19870910; JP225224/87 19870910
- 主分类号: H05H1/46
- IPC分类号: H05H1/46 ; H05H1/30 ; H01S3/097 ; H01S3/03 ; H05K1/18
公开/授权文献
- EP0280044A3 Plasma apparatus 公开/授权日:1991-10-23
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