发明公开
- 专利标题: A resin sealed semiconductor device and a method for making the same
- 专利标题(中): 树脂密封半导体器件及其制造方法
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申请号: EP88305024.7申请日: 1988-06-02
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公开(公告)号: EP0294190A3公开(公告)日: 1990-11-14
- 发明人: Shibata, Hiroshi , Maehara, Fuyuki , Shintai, Akira , Kato, Hidetoshi
- 申请人: NIPPONDENSO CO., LTD.
- 申请人地址: 1-1, Showa-cho Kariya-shi Aichi-ken JP
- 专利权人: NIPPONDENSO CO., LTD.
- 当前专利权人: NIPPONDENSO CO., LTD.
- 当前专利权人地址: 1-1, Showa-cho Kariya-shi Aichi-ken JP
- 代理机构: Dempster, Benjamin John Naftel
- 优先权: JP142043/87 19870605; JP108520/88 19880430
- 主分类号: H01L23/29
- IPC分类号: H01L23/29 ; H01L23/10 ; H02J7/26
摘要:
This invention provides a resin sealed IC regulator (1), which comprises a first connecting terminal (113) electrically connected to a generator, a second connecting terminal (115) electrically connected to a device other than the generator, a monolithic IC (16) which controls an operation of the generator, mounted on a conductive member (11), and connected to both the first connecting terminal and the second connecting terminal, a resin molded portion (13) of an electric insulating resin sealing the monolithic IC and at least a portion of the first and second connecting terminals (113, 114, 115) connected to the monolithic IC. Thus an IC regulator which can be effectively used with an electrical load can be obtained, and further, an IC regulator having a more reliable control performance and able to be produced at low production cost can be obtained.
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