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发明公开
EP0343589A1 Semiconductor wafer coating apparatus 失效
Anlage zur Beschichtung von Halbleiterscheiben。

Semiconductor wafer coating apparatus
摘要：
In the coating apparatus disclosed herein, a semiconductor wafer is held on a vacuum chuck (11) mounted on the spindle (15) of a bidirectional servo motor (31). The servo motor (31) is energized by a servo amplifier (33) in response to the amplitude of the control signal provided to the amplifier. Dispensing means are provided for placing coating material on a wafer held in the chuck (11). An oscillator (43) is provided generating a periodic output signal of controllable amplitude and period. A programmable sequencer (35) is operative in a first time period for applying the oscillatory output signal as a control signal to the servo amplifier (33) thereby to angularly oscillate a wafer held in the chuck and for operating the dispensing means (19) to place a predetermined amount of coating material (40) on the wafer. The sequencing means is operative in a later time period for applying a fixed higher amplitude control signal to the servo amplifier thereby to spin the wafer and spread the coating material.
摘要（中）：

在本文所公开的涂覆装置中，半导体晶片被保持在安装在双向伺服电机（31）的主轴（15）上的真空卡盘（11）上。 响应于提供给放大器的控制信号的幅度，伺服电动机（31）由伺服放大器（33）激励。 提供分配装置用于将涂料放置在保持在卡盘（11）中的晶片上。 提供了振荡器（43），其生成可控幅度和周期的周期性输出信号。 可编程序定序器（35）在第一时间段内操作以将振荡输出信号作为控制信号施加到伺服放大器（33），从而使保持在卡盘中的晶片角度地振荡，并将分配装置（19）操作为 将预定量的涂料（40）放置在晶片上。 排序装置在稍后的时间段内操作，以将固定的较高幅度控制信号施加到伺服放大器，从而旋转晶片并铺展涂层材料。

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