发明公开
- 专利标题: A resin flow and curing measuring device
- 专利标题(中): 装置,用于测量流和交联的树脂和方法的属性用于产生合理的流动和交联性能的模具。
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申请号: EP89120184.0申请日: 1989-10-31
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公开(公告)号: EP0367218A2公开(公告)日: 1990-05-09
- 发明人: Saeki, Junichi , Yoshida, Isamu , Kaneda, Aizo , Sugino, Kazuhiro , Nishi, Kunihiko
- 申请人: HITACHI, LTD.
- 申请人地址: 6, Kanda Surugadai 4-chome Chiyoda-ku, Tokyo 101 JP
- 专利权人: HITACHI, LTD.
- 当前专利权人: HITACHI, LTD.
- 当前专利权人地址: 6, Kanda Surugadai 4-chome Chiyoda-ku, Tokyo 101 JP
- 代理机构: Altenburg, Udo, Dipl.-Phys.
- 优先权: JP272966/88 19881031; JP272965/88 19881031
- 主分类号: G01N33/44
- IPC分类号: G01N33/44
摘要:
A measuring device and method for enabling an evaluation of a moldability of a thermosetting resin by determination of parameters suitable for high accuracy forecasting of flow and curing behaviors of the thermosetting resin within a metal mold, as well as a metal mold for molding a thermosetting resin and method for constructing runners of the metal mold which is effective to minimize if not prevent the occurrence of false in moldings. By utilizing unique or peculiar parameters of the thermosetting resin which are not influenced by a molding condition and by conducting a flow simulation with a metal mold having a flow passage of arbitrary dimensions using the determined values for the parameters, a forecasting of a flow in an actual metal mold is enabled so as to preselect optimum molding conditions and flow passage dimensions for a metal mold. FIG. fA
公开/授权文献
- EP0367218B1 A resin flow and curing measuring device 公开/授权日:1996-01-03
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