发明公开
- 专利标题： Improvements relating to soldering processes
- 专利标题（中）： Lötverfahren。
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申请号： EP89312159.0申请日： 1989-11-22
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公开(公告)号： EP0371693A1公开(公告)日： 1990-06-06
- 发明人: Wort, Christopher John , Pickering, Kim Louise , Pedder, David John
- 申请人： GEC-MARCONI LIMITED
- 申请人地址： The Grove, Warren Lane Stanmore, Middlesex HA7 4LY GB
- 专利权人： GEC-MARCONI LIMITED
- 当前专利权人： GEC-MARCONI LIMITED
- 当前专利权人地址： The Grove, Warren Lane Stanmore, Middlesex HA7 4LY GB
- 代理机构： Pope, Michael Bertram Wingate
- 优先权： GB8827933 19881130
- 主分类号： C23G5/00
- IPC分类号： C23G5/00 ; B23K1/20
摘要：
A dry solder reflow process, in which metal surface oxides are removed from the solder surface by abstraction of the oxygen from the metal oxide by atomic hydrogen, the atomic hydrogen being created within an intense microwave frequency plasma of a gas containing hydrogen.
公开/授权文献
- EP0371693B1 Improvements relating to soldering processes 公开/授权日：1994-02-09
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