发明公开
EP0387010A3 Hetero-junction bipolar transistor 失效
异相双极晶体管

Hetero-junction bipolar transistor
摘要:
An object of the present invention is to suppress the surface recombination over the whole area of the external base of a hetero-junction bipolar transistor (HBT), to keep the current gain large, and to reduce the base contact resistance. The HBT of the invention has, as a surface protective film layer, a p-type semiconductor layer which has the higher portential of the energy conduction band than the base layer on an external base outside the junction between the mesa of the n-type emitter layer and the p-type base layer, and a base electrode thereon. Preferably, it has as a base contact layer a p-type semiconductor layer which shows reduced contact resistance with the base electrode on the surface protective layer comprising a p-type semiconductor layer. More preferabiy, it has a structure wherein a base electrode is formed on the base contact layer in contact with the projection part of the emitter electrode to the base contact layers A method of producing this HBT comprises at least the steps of forming an emitter mask on the portion to be an emitter on a multi-layer structure material having an n-type semiconductor layer for forming a collector, a p-type semiconductor layer or forming a base, and an n-type semiconductor layer for forming an emitter in this order from the substrate, and etching by using the emitter mask to form an emitter mesa and to expose a base layer; epitaxially forming as a surface protective film layer a p-type semiconductor layer which show the higher potential of the energy conduction band than the base layer on the external base outside the junction part between the emitter mesa and the base layer by using the emitter mask; and epitaxially forming a base electrode on the p-type surface protective film layer.
公开/授权文献
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IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L29/00 专门适用于整流、放大、振荡或切换,并具有至少一个电位跃变势垒或表面势垒的半导体器件;具有至少一个电位跃变势垒或表面势垒,例如PN结耗尽层或载流子集结层的电容器或电阻器;半导体本体或其电极的零部件(H01L31/00至H01L47/00,H01L51/05优先;除半导体或其电极之外的零部件入H01L23/00;由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00)
H01L29/66 .按半导体器件的类型区分的
H01L29/68 ..只能通过对一个不通有待整流、放大或切换的电流的电极供给电流或施加电位方可进行控制的(H01L29/96优先)
H01L29/70 ...双极器件
H01L29/72 ....晶体管型器件,如连续响应于所施加的控制信号的
H01L29/73 .....双极结型晶体管
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