发明公开
- 专利标题: Multilayered structure
- 专利标题(中): 多层结构
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申请号: EP90105921.2申请日: 1990-03-28
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公开(公告)号: EP0390113A3公开(公告)日: 1991-11-21
- 发明人: Negi, Taichi , Hirofuji, Satoshi
- 申请人: KURARAY CO., LTD.
- 申请人地址: 1621 Sakazu Kurashiki-City JP
- 专利权人: KURARAY CO., LTD.
- 当前专利权人: KURARAY CO., LTD.
- 当前专利权人地址: 1621 Sakazu Kurashiki-City JP
- 代理机构: VOSSIUS & PARTNER
- 优先权: JP80111/89 19890329
- 主分类号: B32B27/30
- IPC分类号: B32B27/30 ; B32B27/32 ; B32B27/36
摘要:
Provided are multilayered structures comprising at least 2 layers consisting of a layer of a composition (C) comprising 50 to 95 wt% of an ethylene-vinyl alcohol copolymer (A) and 50 to 5 wt% of a thermoplastic polyester (B) comprising at least 50 mol% of isophthalic acid base on the total moles of carboxylic acid component and 0.1 to 30 mol% of 1,3-bis(β-hydroxyethoxy)benzene and/or diethylene glycol based on the total moles of diol component, and a layer of a thermoplastic resin (D), said (A) and (D) satisfying the following relationship (I):
110°C ≧ X A - X D ≧ 0°C (I)
wherein X A represents the melting point of A and X D represents the melting point or, in the case of no melting point, the softening temperature, of D. The multilayered structure does not cause, upon heat stretching, particularly upon high-speed heat stretching, to generate pinholes, cracks, irregularities, local thickness irregularities, and have excellent gas barrier property and its reliability.
110°C ≧ X A - X D ≧ 0°C (I)
wherein X A represents the melting point of A and X D represents the melting point or, in the case of no melting point, the softening temperature, of D. The multilayered structure does not cause, upon heat stretching, particularly upon high-speed heat stretching, to generate pinholes, cracks, irregularities, local thickness irregularities, and have excellent gas barrier property and its reliability.
公开/授权文献
- EP0390113B1 Multilayered structure 公开/授权日:1997-01-15
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