An electrolytic process (70) employing a water solution of metal lactates or lactic acid and metal hydroxides, rapidly and safely removes metal plating bleed (42), residual oxides , stains or the like (39), plastic flash (36), resin bleed (36) and deflashing media (38), from electrodes (16) of electronic devices. Anodic etching (72) or a combination of cathodic (82) and anodic (72) etching (72) is preferred. Noble metals are selectively removed without cyanide compounds. For example, excess silver from spot plating on copper leadframes is etched away 2-3 times faster than the underlying copper. After cleaning the device leads (16) are bright, polished, stain-free and without scale, residual plating bleed (42), deflashing media (38), plastic flash or resin bleed (36). The process is effective, less hazardous, easy to use and economical.