The present invention provides a thermoplastic resin composition which comprises:
(i) at least one compatibilizing agent in an amount effective for compatibilization, (ii) (A) a polyphenylene ether in an amount of about 40 - 100% by weight based on the total amount of (A) and (B) and
(B) a homopolymer of alkenyl aromatic compound or a random copolymer of alkenyl aromatic compound and unsaturated compound in an amount of 0-about 60% by weight based on the total amount of (A) and (B), the total amount of (A) and (B) being about 10% by weight or more based on total amount of all polymer components, (iii) at least one polyamide in an amount more than the amount required for forming a continuous phase, and (iv) a compound having a molecular weight of 2,000 or less, containing nitrogen element, and having ring opening or condensation polymerizability or reactivity with acid or amine.