At least part of each of protective layers (1, 4a, 4b, 5a, 5b, 6a, 6b, 6c, 7, 8a, 8b) disposed outside the capacitance generating portion (2) of a film capacitor is of a substantially-unoriented polyphenylene sulfide film (10). The unoriented polyphenylene sulfide film (10) does not shrink substantially even when heated on thermal bonding and soldering, and on the contrary absorbs deformation of the other part of the layer due to thermal shrinkage. Therefore, stability of bonding inside the protective layer and dimensional stability of the protective layer can be secured. As a result, heat-resistance of not only the protective layer but the capacitor can be improved, and it becomes possible to simplify the bonding process and to eliminate the use of adhesive. It is also advantageous for further reducing the sizes of film capacitors.