发明公开
EP0455031A2 Process for forming multi-level coplanar conductor/insulator films employing photosensitive polyimide polymer compositions
失效
制造使用感光性聚酰亚胺多层Koplanarleiter /绝缘体膜的方法。
- 专利标题： Process for forming multi-level coplanar conductor/insulator films employing photosensitive polyimide polymer compositions
- 专利标题（中）： 制造使用感光性聚酰亚胺多层Koplanarleiter /绝缘体膜的方法。
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申请号： EP91105940.0申请日： 1991-04-13
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公开(公告)号： EP0455031A2公开(公告)日： 1991-11-06
- 发明人: Cronin, John Edward , Kaanta, Carter Welling , Previti-Kelly, Rosemary Ann , Ryan, James Gardner
- 申请人： International Business Machines Corporation
- 申请人地址： Old Orchard Road Armonk, N.Y. 10504 US
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： Old Orchard Road Armonk, N.Y. 10504 US
- 代理机构： Schäfer, Wolfgang, Dipl.-Ing.
- 优先权： US516394 19900430
- 主分类号： H01L21/768
- IPC分类号： H01L21/768 ; H01L21/312 ; H01L23/485
摘要：
Disclosed is a process for producing multi-level conductor/insulator films on a processed semiconductor substrate (2) having a conductor pattern (4). The insulator layers (1, 6), each comprise a photosensitive polyimide polymer composition, and this allows the desired wiring channels and stud vias to be formed directly in the insulator layers, without the use of separate masking layers and resulting image transfer steps, thus providing a less cumbersome and costly process.
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