发明公开
- 专利标题： Multi layered wiring board and method for manufacturing the same
- 专利标题（中）： 多层布线板及其制造方法
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申请号： EP93106238.4申请日： 1993-04-16
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公开(公告)号： EP0567016A3公开(公告)日： 1994-03-23
- 发明人: Hattori, Hisao, c/o Itami Works of Sumitomo Elec. , Yoshino, Hiroshi, c/o Itami Works of Sumitomo Elec , Ihara, Tomohiko, c/o Itami Works of Sumitomo Elec , Yamanaka, Shosaku, c/o Itami Works Sumitomo Elec.
- 申请人： Sumitomo Electric Industries, Ltd.
- 申请人地址： 5-33, Kitahama 4-chome, Chuo-ku Osaka 541 JP
- 专利权人： Sumitomo Electric Industries, Ltd.
- 当前专利权人： Sumitomo Electric Industries, Ltd.
- 当前专利权人地址： 5-33, Kitahama 4-chome, Chuo-ku Osaka 541 JP
- 代理机构： Schieschke, Klaus, Dipl.-Ing.
- 优先权： JP99427/92 19920420; JP99579/92 19920420; JP17517/93 19930204
- 主分类号： H05K3/46
- IPC分类号： H05K3/46
摘要：
A multilayered wiring board having a multilayered wiring structure. A first meshed wiring layer (1) having a plurality of holes formed therein and a second wiring layer (2) having a plurality of wirings are provided. The wirings of the second wiring layer wind up and down so as to partially sink in the holes formed in the first wiring layer. In another arrangement, the first wiring layer has a plurality of protrusions protruding into spaces between the adjacent ones of the wirings of the second wiring layer. The crosstalks between the wirings are reduced.
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