发明公开
- 专利标题： Thermal stenciling device
- 专利标题（中）： 热模版设备
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申请号： EP93303994.3申请日： 1993-05-24
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公开(公告)号： EP0572193A2公开(公告)日： 1993-12-01
- 发明人: Okumura, Takashi
- 申请人： BROTHER KOGYO KABUSHIKI KAISHA
- 申请人地址： No. 15-1, Naeshiro-cho, Mizuho-ku Nagoya-shi, Aichi-ken 467 JP
- 专利权人： BROTHER KOGYO KABUSHIKI KAISHA
- 当前专利权人： BROTHER KOGYO KABUSHIKI KAISHA
- 当前专利权人地址： No. 15-1, Naeshiro-cho, Mizuho-ku Nagoya-shi, Aichi-ken 467 JP
- 代理机构： Senior, Alan Murray
- 优先权： JP160304/92 19920527
- 主分类号： B41J3/24
- IPC分类号： B41J3/24 ; B41J2/345
摘要：
A thermal stenciling device in which the heat generating elements are sized to create optimal perforations based upon the type of stencil paper such that the ink does not bleed, produce back images or incompletely dry upon use and a method for determining the size of the heat generating elements. The size is based on desired dot pitches in both the main and sub-scanning directions which are a function of the stencil paper and ink.
公开/授权文献
- EP0572193B1 Thermal stenciling device 公开/授权日：1997-01-22
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